Embedded-die half-bridge power module with enhanced thermal
This patent covers a new physical packaging design for power semiconductor components used in half-bridge circuits — the building blocks of motor drives, inverters, and power converters. The key innovation is embedding the semiconductor die directly into a cutout in the copper layer on top of a ceramic-insulated substrate, rather than mounting it on top. This approach lowers the profile of the package, improves thermal management, and creates better electrical isolation between the high and low sides of the half-bridge. The result is a more compact, thermally efficient power module that can handle higher voltages or switching speeds in a smaller footprint.
What you could build
A drop-in power module package for EV inverters, industrial motor drives, or grid-tied power converters that delivers better thermal dissipation and isolation in a smaller footprint; buyers would be power electronics manufacturers and Tier 1 automotive suppliers.
Who in Virginia should care
Defense and aerospace contractors in Northern Virginia and the Hampton Roads corridor that use power electronics in vehicle and shipboard systems would have procurement interest; General Dynamics and Huntington Ingalls are proximate examples.
Readiness: Concept
Concept — described but not yet demonstrated. Lab validated — supported by experimental results in the patent. Prototype likely — the text describes a built, working embodiment.
Readiness is inferred from the patent text, not from a lab visit.
The record
- Inventors
- Matthias Spieler, Rolando P. Burgos, Dong Dong, Feng Zhou
- Filed
- Patent pending — filed January 10, 2025
- Status
- Application
- Publication number
- US20260206642A1
Ready to talk?
Virginia Tech Intellectual Properties handles licensing for this technology.
Prosim summaries are generated from public patent text and are not legal advice.