Recyclable liquid metal-vitrimer flexible circuit substrate
This technology creates a new class of flexible, electrically conductive material by embedding liquid metal (like gallium-based alloys) into a vitrimer — a special type of polymer that can be reshaped and recycled when heated, unlike conventional plastics. The liquid metal particles form a connected network throughout the polymer, allowing electricity to flow while the overall material remains soft and bendable. Critically, when the device reaches end of life, both the liquid metal and the polymer matrix can be recovered and reused, addressing a major sustainability gap in flexible electronics. This makes it suitable for printed circuit boards, wearable electronics, or soft robotic components that currently end up as non-recyclable waste.
What you could build
A recyclable flexible circuit substrate or printed conductor film sold to electronics manufacturers and PCB fabricators building wearables, soft robotics, or IoT sensor patches — buyers who face growing e-waste regulations and need a drop-in sustainable alternative to conventional flex circuits.
Who in Virginia should care
Northern Virginia and the Hampton Roads corridor host defense electronics contractors and emerging wearables/IoT hardware companies that use flexible PCBs and face DoD sustainability mandates — a natural fit for licensing or sponsored development.
Readiness: Lab validated
Concept — described but not yet demonstrated. Lab validated — supported by experimental results in the patent. Prototype likely — the text describes a built, working embodiment.
Readiness is inferred from the patent text, not from a lab visit.
The record
- Inventors
- Michael D. Bartlett, Josh Worch, Dong Hae Ho, Meng Jiang
- Filed
- Patent pending — filed March 18, 2025
- Status
- Application
- Publication number
- US20250299847A1
Ready to talk?
Virginia Tech Intellectual Properties handles licensing for this technology.
Prosim summaries are generated from public patent text and are not legal advice.