High-density transformer and rectifier array for data center
This technology integrates multiple power transformers directly into a printed circuit board, stacking the transformer windings across PCB layers rather than mounting bulky discrete components on top. Output capacitors are placed along opposite edges of the board, with switching components in between, creating a compact, tiled power conversion cell. The design allows many of these cells to be arrayed together to deliver high power in a very small footprint. The result is a dramatically denser power delivery solution compared to conventional designs that use off-the-shelf transformer modules.
What you could build
An embedded power module or voltage regulator module (VRM) for high-density computing hardware — primarily purchased by hyperscale data center operators, GPU server OEMs, and power electronics suppliers building next-generation rack power delivery systems.
Who in Virginia should care
Northern Virginia hyperscale data center operators and the defense electronics contractors in the DC metro corridor would have direct interest in high-density power delivery for computing infrastructure.
Readiness: Prototype likely
Concept — described but not yet demonstrated. Lab validated — supported by experimental results in the patent. Prototype likely — the text describes a built, working embodiment.
Readiness is inferred from the patent text, not from a lab visit.
The record
- Inventors
- Pranav Raj Prakash, Ahmed Nabih, Qiang Li
- Filed
- Patent pending — filed July 1, 2024
- Status
- Application
- Publication number
- US20250006423A1
Ready to talk?
Virginia Tech Intellectual Properties handles licensing for this technology.
Prosim summaries are generated from public patent text and are not legal advice.