Double-side cooled power module with sintered-silver
This technology is a compact power module — the building block inside inverters and converters — that is cooled on both its top and bottom surfaces simultaneously, allowing it to handle more heat and run at higher power densities. Instead of solid copper connectors between the chips and the cooling substrates, it uses porous silver structures that are bonded using a sintering process. The porous silver is more forgiving of small manufacturing imperfections in chip thickness or substrate flatness, which improves yield and reliability. Testing confirmed the approach works electrically and can sustain operation at high junction temperatures, making it suitable for demanding power electronics applications.
What you could build
A high-reliability power module for electric vehicle traction inverters, industrial motor drives, or grid-edge converters where thermal performance and long service life are critical; primary buyers would be EV powertrain suppliers, industrial drive OEMs, and defense power electronics integrators.
Who in Virginia should care
Defense and aerospace contractors in Northern Virginia and Hampton Roads (e.g., shipboard power systems, airborne power conversion) and data-center power electronics firms would have direct interest in high-reliability, high-density power modules.
Readiness: Lab validated
Concept — described but not yet demonstrated. Lab validated — supported by experimental results in the patent. Prototype likely — the text describes a built, working embodiment.
Readiness is inferred from the patent text, not from a lab visit.
The record
- Inventors
- Guo-Quan LU, Chao DING
- Filed
- Patent pending — filed September 7, 2023
- Status
- Application
- Publication number
- US20240153862A1
Ready to talk?
Virginia Tech Intellectual Properties handles licensing for this technology.
Prosim summaries are generated from public patent text and are not legal advice.