Inductive interconnect layout preventing shoot-through in
This technology addresses a common failure mode in power switching circuits where two transistors or power modules are stacked in series — a configuration used in virtually every DC-AC inverter, motor drive, and power converter. When the lower switch turns on rapidly, it can inadvertently trigger the upper switch to turn on simultaneously, causing a damaging short circuit. The invention uses carefully designed inductive coupling in the wiring interconnections themselves to cancel out the unwanted voltage spikes that cause this false turn-on, without requiring additional active circuitry. The result is a more reliable power stage that resists crosstalk, self-sustained oscillation, and shoot-through faults.
What you could build
A drop-in power module or gate driver board with inductively optimized interconnects for EV inverters, industrial motor drives, or solar inverters; target buyers are power electronics OEMs and module manufacturers seeking improved reliability without added active protection circuitry.
Who in Virginia should care
Virginia-based defense and aerospace contractors (e.g., those supporting Naval surface or submarine power systems) and data center power supply manufacturers would have direct interest in robust high-reliability power switching.
Readiness: Prototype likely
Concept — described but not yet demonstrated. Lab validated — supported by experimental results in the patent. Prototype likely — the text describes a built, working embodiment.
Readiness is inferred from the patent text, not from a lab visit.
The record
- Inventors
- Chi-Ming WANG, Yincan Mao, Zichen Miao, Khai Ngo
- Granted
- May 23, 2017
- Status
- Granted patent
- Patent number
- 9660643
Ready to talk?
Virginia Tech Intellectual Properties handles licensing for this technology.
Prosim summaries are generated from public patent text and are not legal advice.