Silver nanoparticle paste for power electronics
This technology is a silver-based paste made of extremely tiny metal particles — less than 100 nanometers across — that can be used to bond electronic components to substrates with strong electrical, thermal, and mechanical connections. Because the particles are so small, they fuse together (sinter) at much lower temperatures than conventional metal pastes, eliminating the need for high pressure during bonding. The process uses a carefully staged heating sequence — gradual drying followed by stepwise sintering — to ensure complete, void-free bonds. The resulting joint can then withstand very high operating temperatures, making it especially valuable for next-generation power semiconductors made from materials like silicon carbide (SiC) and gallium nitride (GaN).
What you could build
A ready-to-use silver nanoparticle sinter paste sold to power electronics manufacturers and packaging houses for die-attach in high-temperature SiC and GaN power modules; buyers would be EV powertrain suppliers, industrial motor drive makers, and defense electronics assemblers.
Who in Virginia should care
Virginia-based defense electronics and power electronics contractors (e.g., firms supporting Navy/DoD wide-bandgap power module programs at Dahlgren or Arlington primes) would have direct use for high-reliability, high-temperature die-attach materials.
Readiness: Lab validated
Concept — described but not yet demonstrated. Lab validated — supported by experimental results in the patent. Prototype likely — the text describes a built, working embodiment.
Readiness is inferred from the patent text, not from a lab visit.
The record
- Inventors
- Guo-Quan LU, Guangyin Lei, Jesus N. Calata
- Granted
- September 4, 2012
- Status
- Granted patent
- Patent number
- 8257795
Ready to talk?
Virginia Tech Intellectual Properties handles licensing for this technology.
Prosim summaries are generated from public patent text and are not legal advice.