3D-stacked embedded power module for high-density DC-DC
This technology describes a compact, three-dimensional power module that stacks an inductor, a heat-spreading layer, and active switching components (transistors) on top of each other rather than arranging them side by side on a flat circuit board. The inductor is built from a specialized ceramic material (LTCC) that allows a thick copper conductor to run through it, improving efficiency and reducing size. A built-in heat spreader sits between the layers to manage the thermal load generated during operation. The result is a significantly smaller, more thermally efficient power conversion unit—like a DC-DC converter—than conventional planar designs allow.
What you could build
A miniaturized DC-DC converter module for power-dense applications such as server power supplies, electric vehicle on-board chargers, or military electronics, sold to OEMs and electronics manufacturers who need high efficiency in tight spaces.
Who in Virginia should care
Defense electronics primes and government contractors in Northern Virginia and the Hampton Roads corridor who supply compact power systems for military platforms would have direct interest.
Readiness: Lab validated
Concept — described but not yet demonstrated. Lab validated — supported by experimental results in the patent. Prototype likely — the text describes a built, working embodiment.
Readiness is inferred from the patent text, not from a lab visit.
The record
- Inventors
- Michele H. Lim, Zhenrian Liang, J. D. Wyk
- Granted
- April 26, 2011
- Status
- Granted patent
- Patent number
- 7932800
Ready to talk?
Virginia Tech Intellectual Properties handles licensing for this technology.
Prosim summaries are generated from public patent text and are not legal advice.