Moisture-sealed housing for high-density power modules
This technology solves a persistent engineering challenge in high-power electronics: how to create a reliable, sealed electrical connection between a power module and its circuit board without allowing moisture, contaminants, or dangerous electric field concentrations to compromise the joint. The design uses a specially shaped aperture in the housing—with a carefully engineered transitional geometry—that the circuit board sits directly over and seals, while a terminal pin makes contact with the board inside that protected cavity. The transitional feature redistributes electrical stress at the edges of the interface, preventing premature insulation breakdown that would otherwise shorten the module's life. The result is a compact, robust power module package suited for demanding environments where reliability and high voltage operation are non-negotiable.
What you could build
A sealed power module housing architecture licensed to or adopted by manufacturers of electric vehicle inverters, industrial motor drives, or renewable energy converters—any OEM or Tier-1 supplier building high-density power electronics that must survive harsh operating environments.
Who in Virginia should care
Defense electronics and power conversion suppliers in Northern Virginia and the Hampton Roads corridor—particularly those building ruggedized power systems for naval or ground vehicle platforms—would have direct interest.
Readiness: Prototype likely
Concept — described but not yet demonstrated. Lab validated — supported by experimental results in the patent. Prototype likely — the text describes a built, working embodiment.
Readiness is inferred from the patent text, not from a lab visit.
The record
- Inventors
- Christina DiMarino, Mark Cairnie, Dushan Boroyevich, Rolando Burgos, C. Mark Johnson
- Granted
- April 9, 2024
- Status
- Granted patent
- Patent number
- 11956914
Ready to talk?
Virginia Tech Intellectual Properties handles licensing for this technology.
Prosim summaries are generated from public patent text and are not legal advice.