Low-inductance shielded laminated bus bar for power inverters
This technology is a specially designed layered electrical bus bar — essentially a flat, sandwiched conductor that carries high currents in power electronics systems like inverters and converters. By stacking positive, negative, and ground layers in a specific order with carefully chosen insulation thicknesses, the structure dramatically reduces electromagnetic interference (EMI) and parasitic inductance, which are two major causes of noise, heat, and inefficiency in power electronics. Ground layers wrap around the outside of the stack like a shield, and an optional middle ground layer can further suppress electric fields. The design can be integrated directly with other power electronics components, making it suitable for compact, high-performance power conversion hardware.
What you could build
A drop-in laminated bus bar component for high-power inverters, EV drivetrains, data center power supplies, or industrial motor drives; the buyers would be power electronics OEMs, EV manufacturers, and defense/aerospace integrators seeking compact, low-noise power distribution.
Who in Virginia should care
Defense and aerospace contractors in Northern Virginia (Leidos, Northrop, BAE Systems) and naval systems integrators in the Hampton Roads area would have direct interest in low-EMI bus structures for power-dense electronics.
Readiness: Prototype likely
Concept — described but not yet demonstrated. Lab validated — supported by experimental results in the patent. Prototype likely — the text describes a built, working embodiment.
Readiness is inferred from the patent text, not from a lab visit.
The record
- Inventors
- Jun Wang, Rolando Burgos, Dushan Boroyevich, Joshua Stewart, Yue Xu
- Granted
- May 17, 2022
- Status
- Granted patent
- Patent number
- 11335649
Ready to talk?
Virginia Tech Intellectual Properties handles licensing for this technology.
Prosim summaries are generated from public patent text and are not legal advice.