Combined EMI-filtering cooler for high-frequency power modules
This technology is a power electronics package that solves a persistent thermal and electrical noise problem at the same time. It sandwiches a semiconductor chip between a specially shaped metal cooler and a ring of magnetic material that wraps snugly around a raised bump on the cooler. The magnetic ring acts as an inductor that suppresses electromagnetic interference (EMI) generated by high-frequency switching, while the cooler simultaneously pulls heat away from the chip. By integrating both functions into a single compact package, it eliminates the need for separate EMI filter components that would otherwise take up board space and add cost.
What you could build
A compact, integrated power module for industrial motor drives, EV inverters, or power supplies, where the cooler and EMI filter are one unit; sold to power electronics manufacturers and tier-one automotive suppliers looking to shrink module size and bill of materials.
Who in Virginia should care
Defense electronics and power conversion companies in Northern Virginia and the Hampton Roads corridor — particularly suppliers to naval shipboard power systems or data center power infrastructure — would have practical interest in compact, low-EMI power modules.
Readiness: Prototype likely
Concept — described but not yet demonstrated. Lab validated — supported by experimental results in the patent. Prototype likely — the text describes a built, working embodiment.
Readiness is inferred from the patent text, not from a lab visit.
The record
- Inventors
- Khai NGO, Chi-Ming WANG, Han CUI
- Granted
- May 14, 2019
- Status
- Granted patent
- Patent number
- 10290587
Ready to talk?
Virginia Tech Intellectual Properties handles licensing for this technology.
Prosim summaries are generated from public patent text and are not legal advice.