Power module with integrated EMI-suppressing inductor cooler
This technology is a power electronics package that integrates an electromagnetic interference (EMI) suppression component directly into the device's cooling system. A magnetic material is fitted snugly around a protruding feature on the cooler, sitting right beneath the semiconductor chip. This physical arrangement allows the cooler to simultaneously remove heat and dampen the high-frequency electrical noise that power semiconductors naturally generate. By combining two functions into one compact structure, the design eliminates the need for separate EMI filtering components.
What you could build
A compact power module for electric vehicle inverters, industrial motor drives, or power converters where size, thermal management, and EMI compliance all matter simultaneously; the likely buyers are Tier 1 automotive suppliers and power module manufacturers seeking to reduce component count and pass regulatory EMI standards.
Who in Virginia should care
Defense and aerospace electronics manufacturers in Northern Virginia or the Hampton Roads corridor, as well as power electronics suppliers serving naval and military platforms, would have clear interest in compact, EMI-hardened power packaging.
Readiness: Prototype likely
Concept — described but not yet demonstrated. Lab validated — supported by experimental results in the patent. Prototype likely — the text describes a built, working embodiment.
Readiness is inferred from the patent text, not from a lab visit.
The record
- Inventors
- —
- Granted
- May 14, 2019
- Status
- Granted patent
- Patent number
- 102834
Ready to talk?
Virginia Tech Intellectual Properties handles licensing for this technology.
Prosim summaries are generated from public patent text and are not legal advice.