Low-profile inductor substrate for data centers
This technology is a ultra-thin, flat inductor component that can be embedded directly into a circuit board and used in compact, high-power electronics like voltage regulators and power converters. It works by routing electrical current through vertical holes (vias) in a thin sheet of magnetic material, with the sheet itself acting as the inductor core. A precisely engineered slot cut into the magnetic material controls how the two coupled windings interact, keeping the inductance stable across varying load conditions and improving how quickly the converter responds to sudden changes in power demand. The result is a power component that is far thinner than conventional inductors while delivering better electrical performance.
What you could build
An embeddable power inductor substrate sold to manufacturers of voltage regulator modules (VRMs) for server CPUs, GPUs, and telecommunications hardware, where space and transient response are critical competitive differentiators; primary buyers would be power electronics component suppliers and ODMs serving hyperscale data center and networking OEMs.
Who in Virginia should care
Northern Virginia's hyperscale data center cluster creates demand for high-efficiency server power components; defense electronics contractors in the region also require compact power conversion hardware.
Readiness: Prototype likely
Concept — described but not yet demonstrated. Lab validated — supported by experimental results in the patent. Prototype likely — the text describes a built, working embodiment.
Readiness is inferred from the patent text, not from a lab visit.
The record
- Inventors
- Yipeng Su, Dongbin Hou, Fred C. Lee, Qiang Li
- Granted
- October 23, 2018
- Status
- Granted patent
- Patent number
- 10109404
Ready to talk?
Virginia Tech Intellectual Properties handles licensing for this technology.
Prosim summaries are generated from public patent text and are not legal advice.